Commit a6e0c839f999 for kernel

commit a6e0c839f999007721d060618b6ca2134dad46a9
Author: Dipa Ramesh Mantre <dipa.mantre@oss.qualcomm.com>
Date:   Fri Sep 11 10:33:03 2026 +0530

    remoteproc: qcom_q6v5_pas: Add QMI TMD cooling support for Shikra

    Add QMI TMD instance IDs and cooling device name arrays for CDSP
    and MPSS subsystems on Shikra to enable thermal mitigation support.

    Signed-off-by: Dipa Ramesh Mantre <dipa.mantre@oss.qualcomm.com>
    Link: https://lore.kernel.org/r/20260911-shikra_qmi_tmd-v1-1-96c1cca82f30@oss.qualcomm.com
    Signed-off-by: Bjorn Andersson <andersson@kernel.org>

diff --git a/drivers/remoteproc/qcom_q6v5_pas.c b/drivers/remoteproc/qcom_q6v5_pas.c
index abc59c0c29f0..5a89d08ff001 100644
--- a/drivers/remoteproc/qcom_q6v5_pas.c
+++ b/drivers/remoteproc/qcom_q6v5_pas.c
@@ -1792,6 +1792,9 @@ static const struct qcom_pas_data shikra_cdsp_resource = {
 	.sysmon_name = "cdsp",
 	.ssctl_id = 0x17,
 	.smem_host_id = 5,
+	.tmd_instance_id = 0x43,
+	.tmd_name = cdsp_tmd_name,
+	.num_tmd = ARRAY_SIZE(cdsp_tmd_name),
 };

 static const struct qcom_pas_data shikra_lpaicp_resource = {
@@ -1820,6 +1823,9 @@ static const struct qcom_pas_data shikra_mpss_resource = {
 	.ssr_name = "mpss",
 	.sysmon_name = "modem",
 	.ssctl_id = 0x12,
+	.tmd_instance_id = 0x0,
+	.tmd_name = modem_tmd_name,
+	.num_tmd = ARRAY_SIZE(modem_tmd_name),
 };

 static const struct qcom_pas_data sm8650_cdsp_resource = {