Commit 9b7e2fe0fe37 for kernel

commit 9b7e2fe0fe37f79e35467929d578c8c9f0f9cfdd
Merge: 94d32f1ace8e 15a3cbce3299
Author: Miquel Raynal <miquel.raynal@bootlin.com>
Date:   Sun Aug 23 14:30:31 2026 +0200

    Merge tag 'nand/for-7.3' into mtd/next

    * Raw NAND changes
    - Sunxi: Support added for the H616 compatible
    - Qcom: Support added for the MDM9607 compatible
    - Support for the Toshiba TC58NVG1S3H part
    - GPMI: New debugfs entry to expose the chip geometry
    - PL353: Timing updates and software ECC support have been fixed

    * SPI NAND changes
    - fmsh: Support added for FM25G{01,02}B chips
    - HeYangTek: Support added for HYF1GQ4UDACAE

    Aside from these main changes, there is the usual load of misc fixes and
    hardening changes.